Effect of additives on copper outplating onto silicon surface from dilute HF solutions

Keyphrases

• Additive Effect 100%
• Silicon Surface 100%
• HF Solution 100%
• Dynamic Light Scattering 66%
• Surfactant 66%
• Strong Interaction 66%
• Anionic Surfactant 66%
• Electron Microscopy 33%
• Fluorescence Lifetime 33%
• Ions in Solution 33%
• Scattering Microscopy 33%
• Nickel Ion 33%
• Copper Contamination 33%
• X-ray Fluorescence 33%
• Time-of-flight Secondary Ion Mass Spectrometry (ToF-SIMS) 33%
• Cupric Ion 33%
• Non-redox 33%
• Total Reflectance 33%

Material Science

• Silicon 100%
• Surface Active Agent 66%
• Anionic Surfactant 66%
• Nickel Ion 33%
• Electron Microscopy 33%
• Secondary Ion Mass Spectrometry 33%
• X-Ray Fluorescence Spectroscopy 33%