Dynamic Lateral Force Measurements during Chemical Mechanical Polishing of Silica

U. Mahajan, M. Bielmann, R. K. Singh

Research output: Contribution to journalArticlepeer-review

53 Scopus citations

Abstract

Lateral frictional force measurement provides an understanding of pad-surface interactions in chemical mechanical polishing. The lateral forces have been found to be significantly dependent on the surface roughness of the silica, thus showing that in situ dynamic changes in the surface roughness could be observed. Studies of the effect of pH and ionic strength on polishing characteristics of silica are presented. The studies were conducted with particle-free slurries, so as to obtain a better signal-to-noise ratio. The rate of material removal as a function of pH and ionic strength was determined and correlated with the friction force measurements.

Original languageEnglish
Pages (from-to)80-82
Number of pages3
JournalElectrochemical and Solid-State Letters
Volume2
Issue number2
DOIs
StatePublished - Feb 1999
Externally publishedYes

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