TY - GEN
T1 - Dual-VT 4kb sub-VT memories with <1 pW/bit leakage in 65 nm CMOS
AU - Andersson, Oskar
AU - Mohammadi, Babak
AU - Meinerzhagen, Pascal
AU - Burg, Andreas
AU - Rodrigues, Joachim Neves
PY - 2013
Y1 - 2013
N2 - Two standard-cell based subthreshold (sub-VT) memories (SCMs) are presented. The SCMs accomplish the task of robust sub-VT storage and fill the gap of missing sub-VT memory compilers. The storage elements (latches) of these SCMs are custom-designed cells using a dual-V T approach to improve reliability and balance timing. Additionally, two read-logic styles are presented: 1) a segmented 3-state implementation that increases performance compared to a pure 3-state implementation; and 2) a purely MUX-based implementation with the first stage (NAND gate) integrated into the storage cell. Silicon measurements of two 4kb SCMs manufactured in a low-power 65nm CMOS technology show that read access speed increases by 4X and 8X compared to a pure 3-state implementation for the segmented 3-state and integrated NAND, respectively, while bit-access energy only increases by 2.7X and 2X to 39 and 29 fJ, respectively.
AB - Two standard-cell based subthreshold (sub-VT) memories (SCMs) are presented. The SCMs accomplish the task of robust sub-VT storage and fill the gap of missing sub-VT memory compilers. The storage elements (latches) of these SCMs are custom-designed cells using a dual-V T approach to improve reliability and balance timing. Additionally, two read-logic styles are presented: 1) a segmented 3-state implementation that increases performance compared to a pure 3-state implementation; and 2) a purely MUX-based implementation with the first stage (NAND gate) integrated into the storage cell. Silicon measurements of two 4kb SCMs manufactured in a low-power 65nm CMOS technology show that read access speed increases by 4X and 8X compared to a pure 3-state implementation for the segmented 3-state and integrated NAND, respectively, while bit-access energy only increases by 2.7X and 2X to 39 and 29 fJ, respectively.
UR - http://www.scopus.com/inward/record.url?scp=84891114305&partnerID=8YFLogxK
U2 - 10.1109/esscirc.2013.6649106
DO - 10.1109/esscirc.2013.6649106
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AN - SCOPUS:84891114305
SN - 9781479906437
T3 - European Solid-State Circuits Conference
SP - 197
EP - 200
BT - ESSCIRC 2013 - Proceedings of the 39th European Solid-State Circuits Conference
T2 - 39th European Solid-State Circuits Conference, ESSCIRC 2013
Y2 - 16 September 2013 through 20 September 2013
ER -