CMP slurry design and developments related to new materials

Rajiv K. Singh

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


Chemical mechanical planarization (CMP) is recognized by the semiconductor industry as the technology of choice for eliminating local and global topographic variations on flat wafers. Several factors including a large number of input variables play a key role in controlling the CMP output parameters. One of the most important variables is the slurry composition which includes chemical additives and abrasive particles. This talk will provide a fundamental basis for slurry design to control the CMP output parameters.

Original languageEnglish
Title of host publicationOptical Fabrication and Testing, OFT 2008
PublisherOptical Society of America (OSA)
ISBN (Print)9781557528612
StatePublished - 2008
Externally publishedYes
EventOptical Fabrication and Testing, OFT 2008 - Rochester, NY, United States
Duration: 21 Oct 200824 Oct 2008

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701


ConferenceOptical Fabrication and Testing, OFT 2008
Country/TerritoryUnited States
CityRochester, NY


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