@inproceedings{c4541f46c49f4208bc06154587e64957,
title = "CMP slurry design and developments related to new materials",
abstract = "Chemical mechanical planarization (CMP) is recognized by the semiconductor industry as the technology of choice for eliminating local and global topographic variations on flat wafers. Several factors including a large number of input variables play a key role in controlling the CMP output parameters. One of the most important variables is the slurry composition which includes chemical additives and abrasive particles. This talk will provide a fundamental basis for slurry design to control the CMP output parameters.",
author = "Singh, {Rajiv K.}",
year = "2008",
doi = "10.1364/oft.2008.ofa1",
language = "אנגלית",
isbn = "9781557528612",
series = "Optics InfoBase Conference Papers",
publisher = "Optical Society of America (OSA)",
booktitle = "Optical Fabrication and Testing, OFT 2008",
note = "Optical Fabrication and Testing, OFT 2008 ; Conference date: 21-10-2008 Through 24-10-2008",
}