Characterization of the chemical effects of ceria slurries for chemical mechanical polishing

Keyphrases

• Chemical Effect 100%
• Chemical Mechanical Polishing 100%
• Ceria Slurry 100%
• Ceria 57%
• Cantilever 42%
• Ceria-silica 42%
• Atomic Force Microscope 28%
• PH Dependence 28%
• Shallow Trench Isolation 28%
• Polishing Models 28%
• In Situ 14%
• Silica 14%
• Scanning Electron Microscope 14%
• Spectroscopic Investigation 14%
• Mechanism-based 14%
• Chemical Vapor Deposition 14%
• Silica Coating 14%
• Pulsed Laser Deposition 14%
• Scanning Electron Microscope Imaging 14%
• Imaging Analysis 14%
• Highly Selective 14%
• Tapping Mode 14%
• Oxide Materials 14%
• Elemental Composition 14%
• Thermal Oxidation 14%
• Chemical Reactivity 14%
• Particle-based 14%
• Chemical Interaction 14%
• Slurry 14%
• Abrasive 14%
• Compositional Analysis 14%
• Microscopic Investigation 14%
• Polishing Step 14%
• Ceria Thin Films 14%
• Ceria-Based 14%
• Glass Polishing 14%
• Friction Force Measurement 14%
• Polishing Mechanism 14%
• Fixed Abrasive Pad 14%
• Wear Profile 14%

Material Science

• Cerium Oxide 100%
• Chemical Mechanical Planarization 100%
• Silicon Dioxide 50%
• Scanning Electron Microscopy 20%
• Oxidation Reaction 10%
• Chemical Vapor Deposition 10%
• Silicon 10%
• Pulsed Laser Deposition 10%
• Polishing 10%
• Oxide Compound 10%
• Thin Films 10%

Chemical Engineering

• Cerium Compound 100%
• Chemical Vapor Deposition 10%
• Vapor Deposition 10%
• Pulsed Laser Deposition 10%
• Force Measurement 10%