Characterization of chemical interactions on copper chemical mechanical polishing (CMP)

Keyphrases

• Mechanical Properties 100%
• Chemical Interaction 100%
• Copper Chemical Mechanical Polishing 100%
• Thin Surface Layer 66%
• Chemical Mechanical Polishing 66%
• Metal Surface 33%
• Electrochemical Measurements 33%
• Surface Layer 33%
• Complexing Agent 33%
• Reflectivity Measurement 33%
• Copper Surface 33%
• Formation Kinetics 33%
• Nanoindentation 33%
• Oxidizer 33%
• Chemical Additives 33%
• Polishing Process 33%
• Formation Dynamics 33%
• Nanostructured Surface Layer 33%
• Layer Control 33%

Engineering

• Chemical Mechanical Polishing 100%
• Surface Layer 100%
• Transients 25%
• Polishing Process 25%
• Complexing Agent 25%
• Nanoscale 25%
• Oxidizer 25%

Material Science

• Chemical Mechanical Planarization 100%
• Metal Surface 33%
• Reflectivity 33%
• Nanoindentation 33%