Abstract
This paper addresses the problem of defect segmentation in semiconductor manufacturing. The input of our segmentation is a scanning-electron-microscopy (SEM) image of the candidate defect region. We train a U-net shape network to segment defects using a dataset of clean background images. The samples of the training phase are produced automatically such that no manual labeling is required. To enrich the dataset of clean background samples, we apply defect implant augmentation. To that end, we apply a copy-and-paste of a random image patch in the clean specimen. To improve the robustness of the unlabeled data scenario, we train the features of the network with unsupervised learning methods and loss functions. Our experiments show that we succeed to segment real defects with high quality, even though our dataset contains no defect examples. Our approach performs accurately also on the problem of supervised and labeled defect segmentation.
Original language | English |
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Title of host publication | 2022 IEEE International Conference on Image Processing, ICIP 2022 - Proceedings |
Publisher | IEEE Computer Society |
Pages | 306-310 |
Number of pages | 5 |
ISBN (Electronic) | 9781665496209 |
DOIs | |
State | Published - 2022 |
Externally published | Yes |
Event | 29th IEEE International Conference on Image Processing, ICIP 2022 - Bordeaux, France Duration: 16 Oct 2022 → 19 Oct 2022 |
Publication series
Name | Proceedings - International Conference on Image Processing, ICIP |
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ISSN (Print) | 1522-4880 |
Conference
Conference | 29th IEEE International Conference on Image Processing, ICIP 2022 |
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Country/Territory | France |
City | Bordeaux |
Period | 16/10/22 → 19/10/22 |
Bibliographical note
Publisher Copyright:© 2022 IEEE.
Keywords
- Contrastive Learning
- Data Augmentation
- Defect Segmentation