TY - JOUR
T1 - Applications of flexible polyimide
T2 - barrier material, sensor material, and functional material
AU - Lin, Jiahui
AU - Su, Jingtao
AU - Weng, Mengman
AU - Xu, Weihao
AU - Huang, Jintao
AU - Fan, Tianju
AU - Liu, Yidong
AU - Min, Yonggang
N1 - Publisher Copyright:
© The Author(s) 2023. Open Access.
PY - 2023/3
Y1 - 2023/3
N2 - Polyimide (PI), as an advanced polymer material, possesses the intrinsic merits of excellent resistance to extreme temperatures, good dielectric properties, flame resistance, strong processibility, biocompatibility, and flexibility. The outstanding performances of flexible PI have led to a wide range of applications in aerospace, medical, intelligent electronic devices, energy storage devices, and more. Notably, due to the swift progress of various flexible and soft devices, flexible PI has become ubiquitous in the form of thin films, fibers, and foam and gradually plays an indispensable role in all sorts of those devices. This review mainly focuses on the current advances in the usage of flexible PI for barrier, sensor, and functional purposes. Firstly, the key features of various methods for synthesizing and processing PI, as well as the relationship with their respective applications, are summarized. Secondly, to give readers a comprehensive view of the various applications of flexible PI materials, the applications are broken down into three categories: flexible barrier applications, flexible sensing applications, and flexible function applications, and the current research of each application is introduced in detail. Finally, a summary of the challenges and possible solutions in some flexible applications is present.
AB - Polyimide (PI), as an advanced polymer material, possesses the intrinsic merits of excellent resistance to extreme temperatures, good dielectric properties, flame resistance, strong processibility, biocompatibility, and flexibility. The outstanding performances of flexible PI have led to a wide range of applications in aerospace, medical, intelligent electronic devices, energy storage devices, and more. Notably, due to the swift progress of various flexible and soft devices, flexible PI has become ubiquitous in the form of thin films, fibers, and foam and gradually plays an indispensable role in all sorts of those devices. This review mainly focuses on the current advances in the usage of flexible PI for barrier, sensor, and functional purposes. Firstly, the key features of various methods for synthesizing and processing PI, as well as the relationship with their respective applications, are summarized. Secondly, to give readers a comprehensive view of the various applications of flexible PI materials, the applications are broken down into three categories: flexible barrier applications, flexible sensing applications, and flexible function applications, and the current research of each application is introduced in detail. Finally, a summary of the challenges and possible solutions in some flexible applications is present.
KW - Polyimide
KW - applications
KW - flexible materials
UR - http://www.scopus.com/inward/record.url?scp=85166245773&partnerID=8YFLogxK
U2 - 10.20517/ss.2022.24
DO - 10.20517/ss.2022.24
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AN - SCOPUS:85166245773
SN - 2769-5441
VL - 3
JO - Soft Science
JF - Soft Science
IS - 1
M1 - 2
ER -