Applicability of 3GPP Indoor Hotspot Models to the Industrial Environments

Wenbo Wang, Elena Simona Lohan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

In this paper we study the applicability of the 3GPP Indoor Hotspot model (InH from TR38.901 document) to the indoor industrial environments with moving robots. We will show the impact of carrier frequencies on the expected path losses as we move from cmWave to the mm Wave bands, we will present the upper bounds on the capacity expected at different available carrier frequencies and different 3D distances, and we will also discuss the results in the context of receiver sensitivities of various Internet-of-Things solutions for industrial environments, such as Siafox, LoRa., BLE or Wi-SUN.

Original languageEnglish
Title of host publicationICL-GNSS 2018 - 2018 8th International Conference on Localization and GNSS
Subtitle of host publicationSeamless Indoor-Outdoor Localization, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781538669846
DOIs
StatePublished - 20 Aug 2018
Externally publishedYes
Event8th International Conference on Localization and GNSS: Seamless Indoor-Outdoor Localization, ICL-GNSS 2018 - Guimaraes, Portugal
Duration: 26 Jun 201828 Jun 2018

Publication series

NameICL-GNSS 2018 - 2018 8th International Conference on Localization and GNSS: Seamless Indoor-Outdoor Localization, Proceedings

Conference

Conference8th International Conference on Localization and GNSS: Seamless Indoor-Outdoor Localization, ICL-GNSS 2018
Country/TerritoryPortugal
CityGuimaraes
Period26/06/1828/06/18

Bibliographical note

Publisher Copyright:
© 2018 IEEE.

Keywords

  • 3GPP Indoor hotspot channels (InH)
  • cm Wave
  • industrial environments
  • mixed office
  • mm Wave
  • open office

Fingerprint

Dive into the research topics of 'Applicability of 3GPP Indoor Hotspot Models to the Industrial Environments'. Together they form a unique fingerprint.

Cite this