Abstract
In this work, a novel algorithm for improvement of blurred SEM and TEM images of metal ultra-thin films' microstructure has been developed. The algorithm, differently from other existing methods which are based on a priori knowledge about the inspected sample or the imaging system, takes into account the a priori knowledge about the microstructures grain size and shape ranges. The feasibility of the algorithm was examined on totally blurred HRSEM images of copper and silver films microstructures. Our study shows that this algorithm can also be used to improve indistinct images of filled trenches/vias. Thereby, the algorithm may obviate the need for time-consuming selection of SEM/TEM measurement conditions.
| Original language | English |
|---|---|
| Pages (from-to) | 145-148 |
| Number of pages | 4 |
| Journal | Microelectronic Engineering |
| Volume | 92 |
| DOIs | |
| State | Published - Apr 2012 |
Keywords
- Image enhancement algorithm
- ULSI copper and silver interconnect microstructure
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