Abstract
On complex system-on-chips (SOCs), a compact on-die analog-to-digital converter (ADC) is required in high-volume testing, in order to reduce the test time and improve the test coverage of on-die analog intellectual properties (IPs). This paper presents a compact first-order ΣΔ modulator for on-die voltage measurements in such applications. The primary design focus is to achieve a highly compact area so that many instances can be integrated to cover the testing of multiple analog IPs on a single chip die. The proposed modulator deploys an inverter-based architecture which enables the aggressive area reduction. There are two new additional enhancements: 1) hardware dithering to minimize the limit-cycling effect and 2) time-multiplexed pseudodifferential operation for common mode rejection. The modulator exhibits a figure of merit (FOM) of 554.7 fJ/conv-step, in spite of the compact area of only 0.00023 mm2.
| Original language | English |
|---|---|
| Article number | 7370772 |
| Pages (from-to) | 378-390 |
| Number of pages | 13 |
| Journal | IEEE Journal of Solid-State Circuits |
| Volume | 51 |
| Issue number | 2 |
| DOIs | |
| State | Published - 1 Feb 2016 |
| Externally published | Yes |
Bibliographical note
Publisher Copyright:© 2015 IEEE.
Keywords
- Analog design-for-testability (DFT)
- analog-todigital converter (ADC)
- high-volume manufacturing (HVM)
- high-volume testing
- sigma-delta modulation
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