Abstract
Embedded memories dominate area, power, and cost of modern VLSI system-on-chips. While static random access memory (SRAM) is the dominant technology for implementing these memories, Gain-cell embedded DRAM (GC-eDRAM) has been suggested as a possible alternative in recent years. This technology has been shown to provide low-power, logic compatible storage in a reduced silicon footprint, as compared to conventional SRAM. In this paper we suggest a novel GC-eDRAM topology that is capable of storing three voltage levels within a single cell, further improving upon the area and energy-per-bit of the storage solution. The proposed ternary gain-cell is designed in a standard CMOS 65 nm technology node using a low overhead 1/2 VDD write driver for ternary writes and a parallel sensing scheme composed of skewed sense inverters for ternary readout. The proposed approach provides over 3× reduction in static power with a 48% reduction of area-per-bit in comparison with a conventional SRAM cell in the same technology.
Original language | English |
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Title of host publication | 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 - Proceedings |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781538648810 |
DOIs | |
State | Published - 26 Apr 2018 |
Event | 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 - Florence, Italy Duration: 27 May 2018 → 30 May 2018 |
Publication series
Name | Proceedings - IEEE International Symposium on Circuits and Systems |
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Volume | 2018-May |
ISSN (Print) | 0271-4310 |
Conference
Conference | 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 |
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Country/Territory | Italy |
City | Florence |
Period | 27/05/18 → 30/05/18 |
Bibliographical note
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