Abstract
The silicon area of ultra-low power (ULP) applications is often dominated by embedded memories, which are the main consumers of both the static and dynamic power in these applications [1]. Supply voltage scaling down to the sub-threshold region is widely used to significantly reduce both the static and dynamic power dissipation of ULP applications [2]. However, embedded memories, typically implemented with SRAM, have been the limiting factor for aggressive voltage scaling, since the conventional 6-transistor (6T) SRAM bitcell becomes unreliable at near-threshold operating voltages [3-6].
Original language | English |
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Title of host publication | 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 1-3 |
Number of pages | 3 |
ISBN (Electronic) | 9781538637654 |
DOIs | |
State | Published - 2 Jul 2017 |
Event | 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017 - Burlingame, United States Duration: 16 Oct 2017 → 18 Oct 2017 |
Publication series
Name | 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017 |
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Volume | 2018-March |
Conference
Conference | 2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017 |
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Country/Territory | United States |
City | Burlingame |
Period | 16/10/17 → 18/10/17 |
Bibliographical note
Publisher Copyright:© 2017 IEEE.