Wafer Bonder [SUSS Microtec SB6/8 Gen2 ]

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates. The SB6/8 Gen2 is suitable for packaging as well structuring, meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

Specifications:

- Motorized z-Axis for recipe-controlled (no mechanical adjustment required)
- Gate valve and semi-automated load slide to load the transport fixture into the chamber
- Tool force piston design for best possible tool force uniformity
- Bond force up to 20 kN
- Temperature up to 550 °C
- Precision temperature control (< 1 %) and unrivaled uniformity (± 2 %)
- Precise process recipe control for all bond parameters
- Fast heating and active cooling
- Process chamber pressure range from 5 x 10-5 mbar to 1 bar (3 bar abs available as an option)