Equipments Details
Description
Atomic Layer Deposition (or ALD) is an advanced deposition technique that allows for ultra-thin films of a few nanometres to be deposited in a precisely controlled way.
Specifications:
- 6 precursor heated lines
- ICP Plasma
- Ozone reactor
- Material: Oxides
- Unique design for ultra-high aspect ratio structures (> 1:2000)
Specifications:
- 6 precursor heated lines
- ICP Plasma
- Ozone reactor
- Material: Oxides
- Unique design for ultra-high aspect ratio structures (> 1:2000)
Details
Name | Fiji F200 |
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Manufacturers | Cambridge NanoTech |

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